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Hakuto全自动离子刻蚀机MEL3100 用于刻蚀薄膜磁盘

2021-02-01 08:39:37  伯东企业(上海)有限公司  发布
  某薄膜磁盘制造采用Hakuto 全自动离子刻蚀机 MEL3100 用于刻蚀薄膜磁盘去除溅射镀制磁盘薄膜的污染物和提高薄膜的均匀性.

Hakuto 全自动离子刻蚀机 MEL 3100 技术参数:

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Model

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MEL3100

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Main body

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Wafer size

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3"6"

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Power
Supply

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AC200V 3ph 40A

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Wafer per batch

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1 wafer

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*two lines

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Cassette

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No.

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25 wafers

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Cooling
Water

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15 (l/min)

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Q‘ty

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1pc.

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<20

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Throughput

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10 (wafer/hr) *1

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CDA

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0.5 (MPa)

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Pressure

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Ultimate

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8×10-5 (Pa) *2

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>10 (l/min)

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Process

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2×10-2 (Pa) *2

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N2

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0.2 (MPa)

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Etching

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Rate

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>10 (nm/min)@SiO2 *3

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>40 (l/min)

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Uniformity

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±5%@132mm (6") *3

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Ar

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0.2 (MPa)

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Wafer surface temp.

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<100 *3

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20 (sccm)

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Stage rotating

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120 (rpm) ±5%

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He

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0.2 (MPa)

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Stage tilting

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±90°±0.5°

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20 (sccm)

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Dimension
W×D×H (mm)

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Main body

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1,600×2,175×1,900

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*need additional utilities
  for Dry pump

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Co***oller

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640×610×1,900

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Chiller

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555×515×1,025

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Weight (kg)

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Main body

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1,700

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Co***oller

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200

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Chiller

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100

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*1: Estimated process time 5min

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*2: No wafer on stege / process chamber

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*3: Depending on process

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