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Hakuto 全自动离子刻蚀机 MEL3100 用于刻蚀薄膜磁盘
2021-05-14 11:29:30 伯东企业（上海）有限公司 发布
某薄膜磁盘制造采用Hakuto 全自动离子刻蚀机 MEL3100 用于刻蚀薄膜磁盘, 去除溅射镀制磁盘薄膜的污染物和提高薄膜的均匀性.
Hakuto 全自动离子刻蚀机 MEL 3100 技术参数:
|
Model |
MEL3100 |
|
Main body |
||
|
Wafer size |
3"～6" |
|
Power |
AC200V 3ph 40A |
|
|
Wafer per batch |
1 wafer |
|
*two lines |
||
|
Cassette |
No. |
25 wafers |
|
Cooling |
15 (l/min) |
|
Q‘ty |
1pc. |
|
<20℃ |
||
|
Throughput |
10 (wafer/hr) *1 |
|
CDA |
0.5 (MPa) |
|
|
Pressure |
Ultimate |
8×10-5 (Pa) *2 |
|
>10 (l/min) |
|
|
Process |
2×10-2 (Pa) *2 |
|
N2 |
0.2 (MPa) |
|
|
Etching |
Rate |
>10 (nm/min)@SiO2 *3 |
|
>40 (l/min) |
|
|
Uniformity |
±5%@132mm (6") *3 |
|
Ar |
0.2 (MPa) |
|
|
Wafer surface temp. |
<100℃ *3 |
|
20 (sccm) |
||
|
Stage rotating |
1～20 (rpm) ±5% |
|
He |
0.2 (MPa) |
|
|
Stage tilting |
±90°±0.5° |
|
20 (sccm) |
||
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